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LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only
TAPE AND BOX TYPE LED LAMPS
Pb
Lead-Free Parts
LSE2040/P1-PF/TBS-X
DATA SHEET
DOC. NO : REV. DATE : :
QW0905-LSE2040/P1-PF/TBS-X A 05 - Jul. - 2006
LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only
PART NO. LSE2040/P1-PF/TBS-X Page 1/6
Package Dimensions
H
P2
H2 H1 L W0
W2
W1 W3
D
P1
F P
-+
T
LSE2040/P1-PF
4.0 3.0
4.2
5.2 10.550.5
1.5MAX 25.0MIN
0.5 TYP
1.0MIN 2.54TYP
+ -
Note : 1.All dimension are in millimeter tolerance is 0.25mm unless otherwise noted. 2.Specifications are subject to change without notice.
LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only
PART NO. LSE2040/P1-PF/TBS-X Page 2/6
Absolute Maximum Ratings at Ta=25
Ratings Parameter Symbol SE Forward Current Peak Forward Current Duty 1/10@10KHz Power Dissipation Reverse Current @5V Operating Temperature Storage Temperature IF IFP PD Ir Topr Tstg 20 80 80 10 -40 ~ +85 -40 ~ +100 mA mA mW UNIT
A
Typical Electrical & Optical Characteristics (Ta=25 )
PART NO
MATERIAL Emitted
COLOR
Peak wave length
Pnm
Forward Luminous Viewing Spectral voltage intensity angle halfwidth @ 20mA(V) @10mA(mcd) 2 1/2 nm (deg)
Lens 610 45
Min. Max. Min. Typ. 1.7 2.6 8.0 12 36
LSE2040/P1-PF/TBS-X
GaAsP/GaP Orange Orange Diffused
Note : 1.The forward voltage data did not including 0.1V testing tolerance. 2. The luminous intensity data did not including 15% testing tolerance.
LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only
PART NO. LSE2040/P1-PF/TBS-X *Dimension Symbol Information SPECIFICATIONS SYMBOL ITEMS OPTION SYMBOL CODE
-------------------
Page 3/6
Minimum mm inch
0.15 0.09
-------
Maximum mm
4.2 3.0 2.0 18.5 22.5 26.5 23.5 20.9 25.0 25.5 20.0 19.4 22.0 21.5 19.0 36 11
inch
0.17 0.12 0.08 0.73 0.89 1.04 0.93 0.82 0.98 1.0 0.79 0.76 0.87 0.85 0.75 1.42 0.43 0.51 0.23 0.3 0.06 0.38 0.61 0.16 0.75
Tape Feed Hole Diameter Component Lead Pitch Front-To-Rear Deflection
D F
H
3.8 2.3
-------
TBS-1 TBS-2 TBS-3 TBS-5 TBS-6 Feed Hole To Bottom Of Component TBS-7 TBS-8 TBS-9 TBS-10 TBS-11 TBS-12 TBS-13 Feed Hole To Overall Component Height Lead Length After Component Height Feed Hole Pitch Lead Location Center Of Component Location Overall Taped Package Thickness Feed Hole Location Adhesive Tape Width Adhesive Tape Position Tape Width
-------------------------------------------------------------
17.5 21.5 25.5 22.5 19.9 H1 24.0 24.5 19.0 18.4 21.0 20.5 18.0 H2 L P P1 P2 T W0 W1 W2 W3 12.4 4.4 5.1
-------------
0.69 0.85 1.0 0.89 0.78 0.94 0.96 0.75 0.72 0.83 0.81 0.71
-------
W0 0.49 0.17 0.2
-------
13 5.8 7.7 1.42 9.75 15.5 4.0 19
8.5 14.5 0 17.5
0.33 0.57 0 0.69
REMARK:TBS=Tape And Box Straight Leads
* Dimensions Symbol Information
Specification
* Package Dimensions
maxmum mm 340 275 60 inch 13.4 10.8 2.4
Description
Overall Length Overall Width Overall Thickness
Symbol
minimum mm inch 13.0 10.4 1.97
L W H
330 265 50
Quantity/Box
2500PCS
LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only
PART NO. LSE2040/P1-PF/TBS-X Page4/6
Typical Electro-Optical Characteristics Curve
SE CHIP
Fig.1 Forward current vs. Forward Voltage
1000
Fig.2 Relative Intensity vs. Forward Current
3.0
Forward Current(mA)
Relative Intensity Normalize @20mA
1.0 2.0 3.0 4.0 5.0
100
2.5 2.0 1.5 1.0 0.5 0.0 1.0 10 100 1000
10
1.0 0.1
Forward Voltage(V) Fig.3 Forward Voltage vs. Temperature
1.2
Forward Current(mA) Fig.4 Relative Intensity vs. Temperature
3.0
Forward Voltage@20mA Normalize @25
Relative Intensity@20mA Normalize @25
-40 -20 0 20 40 60 80 100
2.5 2.0 1.5 1.0 0.5 0.0 -40 -20 0 20 40 60 80 100
1.1
1.0
0.9
0.8
Ambient Temperature()
Ambient Temperature()
Fig.5 Relative Intensity vs. Wavelength
Directivity Radiation
1.0
Relative Intensity@20mA
0 -30 30
0.5
-60
60
0.0 550 600 650 700 750
100% 75% 50%
25%
0
25%
50% 75% 100%
Wavelength (nm)
LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only
PART NO. LSE2040/P1-PF/TBS-X Page 5/6
Soldering Condition(Pb-Free) 1.Iron: Soldering Iron:30W Max Temperature 350 C Max Soldering Time:3 Seconds Max(One Time) Distance:2mm Min(From solder joint to body)
2.Wave Soldering Profile Dip Soldering Preheat: 120C Max Preheat time: 60seconds Max Ramp-up 2 C/sec(max) Ramp-Down:-5 C/sec(max) Solder Bath:260C Max Dipping Time:3 seconds Max Distance:2mm Min(From solder joint to body)
Temp( C) 260 C3sec Max
260
5 /sec max
120
2 /sec max Preheat
60 Seconds Max
25 0 0
50
100
150
Time(sec)
LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only
PART NO. LSE2040/P1-PF/TBS-X Page 6/6
Reliability Test:
Test Item
Test Condition
1.Under Room Temperature 2.If=20mA 3.t=1000 hrs (-24hrs, +72hrs)
Description
This test is conducted for the purpose of detemining the resistance of a part in electrical and themal stressed.
Reference Standard
MIL-STD-750: 1026 MIL-STD-883: 1005 JIS C 7021: B-1
Operating Life Test
High Temperature Storage Test
1.Ta=105 5 2.t=1000 hrs (-24hrs, +72hrs)
The purpose of this is the resistance of the device which is laid under condition of high temperature for hours.
MIL-STD-883:1008 JIS C 7021: B-10
Low Temperature Storage Test
1.Ta=-40 5 2.t=1000 hrs (-24hrs, +72hrs)
The purpose of this is the resistance of the device which is laid under condition of low temperature for hours.
JIS C 7021: B-12
High Temperature High Humidity Test
1.Ta=65 5 2.RH=90 %~95% 3.t=240hrs 2hrs
The purpose of this test is the resistance of the device under tropical for hours.
MIL-STD-202:103B JIS C 7021: B-11
Thermal Shock Test
1.Ta=105 5&-405 (10min) (10min) 2.total 10 cycles
The purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. This test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire.
MIL-STD-202: 107D MIL-STD-750: 1051 MIL-STD-883: 1011
Solder Resistance Test
1.T.Sol=260 5 2.Dwell time= 10 1sec.
MIL-STD-202: 210A MIL-STD-750: 2031 JIS C 7021: A-1
Solderability Test
1.T.Sol=230 5 2.Dwell time=5 1sec
This test intended to see soldering well performed or not.
MIL-STD-202: 208D MIL-STD-750: 2026 MIL-STD-883: 2003 JIS C 7021: A-2

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